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FPC - Rigid-Flex Circuit + HDI, Multi-layer, Double side, Single-side Design |
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Communication - C: Rigid-Flex Circuit Design |
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Application |
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Auto CCD (Rigid Flex) |
Description |
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4- Layers |
Material Base Film |
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1 mil with 1/2 oz Cu |
Cover Film |
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1/2 mil |
Finished |
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Au / Ni |
L/S |
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4 / 4 mil |
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Application |
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Camera Module (Rigid Flex) |
Description |
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4- Layers |
Material Base Film |
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1 mil with 1/2 oz Cu |
Cover Film |
: |
1/2 mil |
Finished |
: |
Au / Ni |
L/S |
: |
4 / 4 mil |
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.................................................................................................................................. |
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Application |
: |
Camera Module (Rigid Flex) |
Description |
: |
4- Layers |
Material Base Film |
: |
1 mil with 1/2 oz Cu |
Cover Film |
: |
1/2 mil |
Finished |
: |
Au / Ni |
L/S |
: |
4 / 4 mil |
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